The PEI wire enamels solderable can be decomposed with soldering; and those that are stable under the soldering conditions. Solderable PEI resin typically do not contain THEIC monomers within the polymer backbone. Triols such as glycerin and trimethylol propane (TMP) can be used in solderable PEI resin to improve thermal stability while still maintaining soldering properties. In class 180 or 200 non solderable PEI resins, THEIC is incorporated into the polymer backbone. Just as in the polyester resin, THEIC enhances the thermal index (+30%) and other thermal properties.

Wire Enamel 1405

Electro Insulation enamel Primary Insulation Contacts

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