| TONGBOND 6302 | |
| Chemical basis | Polyamide |
| Thermal Index | 130 |
| Comments | Bonds at 140 – 170ºC, solderable, humidity resistant |
| TONGBOND 6304 | |
| Chemical basis | Polyamide |
| Thermal Index | 130 |
| Comments | Bonds at 140 – 170ºC, solderable, humidity resistant, high bonding strength |
| TONGBOND 6304 M | |
| Chemical basis | Polyamide |
| Thermal Index | 130 |
| Comments | Bonds at 140 – 170ºC, solderable, humidity resistant, high bonding strength,low viscosity |
| TONGBOND 6355 | |
| Chemical basis | Phenoxy |
| Thermal Index | 130 |
| Comments | Bonds at 140 – 170ºC |
| TONGBOND 6380 | |
| Chemical basis | Aromatic |
| Thermal Index | 180 |
| Comments | Bonds at 170 – 200ºC, Self-Lubricated |
For further information please contact our Sales Department or Technical Service Department.
November 06, 2008
|
November 06, 2008
|