A flexible silicone with low filler content, halogen free and UL94 V-0 rating: Bectron® SA 70P9-50

Since decades ELANTAS Europe is supporting the electronic industry with insulating resins. In this scope ELANTAS Europe is used to work on various kinds of chemistries such as epoxides, polyurethanes, acrylates, and silicones.

Silicones are important for the electronic industry because of their combination of high temperature resistance and flexibility. Most thermal conductive silicones do come with a UL94 V-0 certificate due to their high amount of inorganic filler. The increased amount of inorganic filler is reducing the flexibility of such materials and makes them less applicable as sealants and shock- as well as vibration absorbing adhesives.

Nevertheless, the need for flexible, almost unfilled single component silicones is highly present in the electronic industry and served by ELANTAS Europe offering various single component moisture cure adhesives such as Bectron® SA 70L1-30 or Bectron® SA 70V1-36. When asking for such a product which provides in addition thixotropic behavior and flame resistance according to UL94 V-0 things are getting difficult.

The ELANTAS Europe development team managed to design such a material: Bectron® SA 70P9-50 (File Number E140720)

Bectron® SA 70P9-50 has been designed for customers in the electronic industry for various applications:

The amount of cyclic D4-siloxane monomers in Bectron® SA 70P9-50 is below 0,1% in weight. The resulting labeling makes the material easier to handle in an industrial environment.

For fixing a printed circuit board in a housing a silicone supports by its capacity for shock-absorbance not only in automotive but also industrial applications.

When sealing a housing which contains a sensitive component inside such as an electronic board or sensors, Bectron® SA 70P9-50 protects against dust and other environmental impacts. But being a silicone, it will also keep its restoring force improving the sealing capacity over long time and possibly allowing to reuse the sealing after opening (Casting in Place Gasket / CIPG) in case of a repair).

The fixing of a component on an electronic board is usually done by epoxides. Silicones however become interesting when the distances between component and board are getting larger as well as the tolerances. In case you have a classical small SMD-component which you want to fix on a PCB with a small slit of around 100 µm epoxides such as ELAN-glue® EP 5340 are the classical and preferred solution. However, when the component is larger and the distance to fix gets into the mm-range instead – the hard epoxide becomes too inflexible to withstand a thermal shock event – then a soft and flexible silicone may become the match-winner providing a shock-absorbing bed for the component on the board. In this application the thixotropic behavior of Bectron® SA 70P9-50 especially supports the L-shape mounting.

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