With our Printed Electronics Days, the industry's top speakers give an insight into innovative and specialist topics of Printed Electronics: roadmap, coating processes, best practice, drying and curing as well as in-mold electronics.
The Printed Electronics Days will take place online and in English language.
Stay up to date, expand your personal skills and register for free. Please register separately for each session.
09:30 – 10:35 h
Session Roadmap Printed Electronics
Dr. Alexander Beer
Head of Business Line Electronic
From smart packaging to rollable TV screens, from sensor networks to energy-harvesting building facades - flexible, organic, and printed electronics enable new applications and open up new markets for established industries. Thin, lightweight, flexible and robust - these are the key features of this technology, which can be seamlessly integrated into numerous products for key industries such as automotive, packaging, consumer electronics or medical technology and pharmaceuticals. In this presentation, the actual OE-A roadmap will be introduced. This roadmap is a joint effort of OE-A members that captures the current state of the art, identifies key challenges and provides an outlook for future product generations.
Dr. Klaus Hecker
OE-A (Organic and Printed Electronics Association)
A working group within VDMA
10:45 – 13:10 h
Session Best practice Part I
Mrs. Suparat Tansangthong
Market Development Manager
T.A.O. BANGKOK CORPORATION LTD.
Dr. Wolfgang Clemens
Director Product Management & Business Development
Member of the Managing Board
PolyIC GmbH & Co. KG – a KURZ Company
The major benefit of printed electronics is the production of electronic components on various substrates with low process temperature and adaptable layouts thus creating thinner and lighter components at lower costs. However, in order to realize this promise, every customer need requires a dedicated or tailor-made solution. Polymers are the basis for these solutions since the polymeric film can be flexible, stretchable or even thermoformable and can be adapted to special substrates such as different plastics or paper. ELANTAS has been serving the electrical and electronics industry with sophisticated polymer chemistry for electrical insulation for more than 100 years. The Product Line Printed Electronics uses this expertise to create functional inks for special customer needs.
This talk outlines the recent developments of ELANTAS in the field of conductive and insulating inks, which enable properties such as high process speed, thermoformability or use at elevated temperatures.
Team Leader R&D Printed Electronics
ELANTAS Europe GmbH
Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was only an idea some years ago and is now produced in millions. Further current products and developments are presented.
Dr. Florian Ullrich
Combining expertise in printing technology, materials science and embedded systems engineering, HyPrint Hybrid Electronics leverages interdisciplinary synergy to offer full-service systems based in part on the printed electronics ecosystem, thereby benefiting from the economics of mass production.
The presentation will focus on systems with partially printed electronic functionalities that are in use, for example, as temperature loggers in the form of flexible, bendable labels. The electronic labels (HyTLog labels) communicate via printed NFC antennas and IC´s with common smartphones, on which, for example, the measurement intervals are specified and the data management is mapped via HyApp. Via HyApp, the temperature data is then transferred to HyCloud systems for further processing.
Furthermore, the potential of Printed Electronics is presented by means of development work and application scenarios with fully printed electrochromic components, batteries and sensors.
Dr. Martin Gutfleisch
13:40 - 15:35 h
Session Coating process
CEO + Founder
Screen printing conductive circuits on flexible substrates not only creates specific demands to the materials but also to the printing equipment.
From adaptive vacuum fixtures, which allow handling of the large and thin flexible substrates, to Optical recognition solutions that enable precise alignment of transparent, glossy or reflective materials and print layers. EKRA shares experience on already realized concepts and current ideas for future solutions. Starting with initial development on a lab size printer and ending with fully automatic production solutions.
EKRA Automatisierungssysteme GmbH
The market of Large Area Organic Printed Electronics is developing rapidly to increase efficiency and quality as well as to lower costs further. Applications for OPV, OLED, RFID, NFC and compact Printed Electronic systems are increasing. In order to make the final products more affordable, but at the same time highly accurate, Roll to Roll (R2R) production on flexible and conductive transparent polymer substrates is the way forward. There are numerous printing and coating technologies suitable depending on the design, the product application and the chemical process technology. Mainly the product design (size, pattern, repeatability) defines the application technology. KROENERT and their sister company Coatema are offering coating, printing and laminating machines to fulfil the requests from the market. In all cases of Printed Large Area conductive and functional Electronics, customized machine solutions and processes are required, based on standardized advanced technology machine components. The largest OPV coating and printing line was delivered to CSEM Brazil. In addition the focus is given to printing of sensors for food packaging applications. We would like to show with the presentation the results of the realized projects with respect to conductive applications and printed electronic, OPV and NFC technology.
Regional Sales Director
KROENERT GmbH & Co KG
Heliosonic is a patented, nozzle-less digital printing process, which makes it possible for the first time to digitally print the familiar materials from screen printing with the precision of inkjet and without contact. Conventional pastes with high filler levels and high binder content can be processed without major modification. The range of applications for Heliosonic technology extends from graphic decoration printing and (conductive) functional printing to high-performance 3D printing.
Head of Heliosonic
09:30 – 11:05 h
Session Drying and curing
Printed conductive structures have to be protected against environmental impact, such as e.g. friction or humidity to guarantee the full functionality of the printed electronics product. Here is when UV coatings come into play. The presentation will show UV coating protection applications in the field of printed electronics incl. case studies.
Sales Manager Industrial
IST METZ GmbH
International Sales Manager
LAMBDA TECHNOLOGY GmbH
What exactly does “Printed Electronics” mean and where can such applications be found on the market today? How far is the technology and why is screen printing so often used instead of offset, flexographic or gravure printing? What possibilities gives the UV curing ink systems from ELANTAS Europe for an efficient print production?
Technical Sales Manager
ELANTAS Europe GmbH
11:20 – 12:55 h
Introduction to screen printing technology:
- Advantages of screen printing versus other printing techniques
Conception of resistant and functional IMD/FIM panels
- First and second surface decoration
- Highly resistant, tactile (and case-by-case pigmented) protective screen printing lacquers for first surface decoration
- Second surface ink layer combinations, with optimized climate & hydrolyses resistance and improved interlayer cohesion
- Day and night design, dead front effects, ambient lighting
- Non-conductive blacks and silver color shades for functional panels and displays
Dr. Hans-Peter Erfurt
Head of IMD/FIM-Technology
High pressure preformed inlays for in-mold processes - Niebling develops, manufactures, and sells systems and tools for the 3D forming of films for the In-Mold Electronics (IME) process. Functionality is already implemented on the 2D film and is then finalized into the finished component via injection molding after preforming on Niebling´s technology. By heating the substrates only up to the glass transition temperature, and not up to the melting temperature as is the case in traditional vacuum thermoforming, significantly more precise tolerances are achieved in so-called High Pressure Forming (HPF) process. 3D geometry and positioning of symbols, conductive tracks or electronic components is formed in repeatable accuracy for mass production.
Director Sales & Marketing
The presentation offers a short insight into a subarea of our research and development department. In addition to the characterization of our printed electronics products, you will find an overview of our application technology and analytical capabilities at the Hamburg site.
Furthermore, the production of smart surfaces with the IMD / FIM process will be discussed. The process based on screen printing and high pressure forming can be extended with printed electronics to integrate touch functions directly into the plastic component.
The process used requires a robust and reliable conductive ink system that can withstand the high temperatures and pressures of thermoforming and molding.
At ELANTAS Europe, we have developed a very high performance ink system for this application. The solutions we can offer are tailor-made for the IMD / FIM process and we are constantly working with our customers to find reliable solutions.
Technical Sales Manager
ELANTAS Europe GmbH
13:25 – 15:35 h
Session Best practice Part II
New generation vehicles will be green, automated and connected, and they will face a change in consumer use with trends such as carpooling.
From these new trends, new challenges arise related to thermal management, batteries, vehicle lightening, energy storage, new communication systems, more sustainable manufacturing.
Printed Electronics can solve some of these challenges with new products and ways of manufacturing.
Dr. Rakel Herrero
Mobility Business Unit
NAITEC. Centro tecnológico en automoción y mecatrónica
Screen-printing is one of the most versatile printing technologies on the market. It can process a huge range of material from low to very high viscosities and filler content. Furthermore, it can be economical for low to high volume production. The brought range of materials and the low tooling costs make it the ideal production process for individual HMI systems.
By using novel materials from printed electronics, we combine traditional membrane keyboards with new functions using state of the art production technologies. New applications are E-paper NFC Tags, pressure sensors mats, directly printed capacitive sensors, flexible LED lighting, customized USB keypads, integrated, flexible NFC readers, wearable heaters and security films. By using available microcontrollers and combining them with printed, flexible circuitry, new hybrid electronics applications are created at very attractive cost structures.
Entwicklungsleiter Gedruckte Elektronik
Kundisch GmbH & Co KG
The presentation will show the possibilities of coating technologies at Folex. Custom coating variety, functional film properties, and a short product overview of scratch resistant and decor films is presented. In addition, of course films and functional solutions for the printed electronic industry are shown.
Dr. Björn Fechner
Head of R&D Folex Group
FOLEX Coating GMBH
Smaller dimensions and higher compression continues to drive electronic industry. As a consequence effective heat management got into focus; the higher the compression of the electronics on the PCB the more difficult the heat dissipation. Insulating materials are restricted by a lower thermal conductivity. Extremely high thermal conductivity can be achieved by electrically conductive silver based adhesives.
Printed electronics already represents a smaller and more flexible solution. The connection to classical components such as LED and Processors however remains critical. An electrically conductive adhesive can form the connection here. The presentation will detail on the latest developments especially on the silver conductive adhesive of ELANTAS Bectron® CG 5660. After the presentation we would be happy to discuss with you the application of the material in the afore mentioned areas.
Dr. Martin Kirchner
Technical Sales Manager
ELANTAS Europe GmbH
Dr. Gerd Krämer
Head of Marketing, Sales & Technology
ELANTAS Europe GmbH