Your electronic module becomes too hot and a change in design is not planned?

In the electronics industry miniaturization and greater levels of performance are key trends. The placement density of electronic components on the PCBs is constantly increasing, resulting in higher heat production, and even causing fire.

ELANTAS Europe has developed a series of thermally conductive casting compounds to counteract this problem.

This newsletter describes how to protect your electronic module with little effort.

This newsletter describes a series of thermally conductive, electrically insulating materials, so-called thermal interface materials (TIM).

These products are available as easy-flowing and self-levelling setting compounds. Besides good thermal conductivity, the materials also furnish additional corrosion protection.

The products described in the overview have the following properties in common:

  • 2-component polyurethane, with different possible mixing proportions

  • Temperature range -50°C to +130°C

  • Flexible mechanical properties for stress compensation

  • Excellent electrical insulating properties

  • Self-extinguishing properties possible

Product

Thermal
Conductivity

W/mK 

Shore
Hardness 

Application
and Curing 

Special Features

Bectron® PU 4568

1.1

A ~90

Thermal encapsulating.
Room temperature curing

easy-flowing and self-levelling
Low CTE*

ELAN-tim® CU 13 AV

1.3

D ~35

Thermal encapsulating.
Room temperature curing

easy-flowing and self-levelling
Low CTE*

ELAN-tim® CU 16 DV 

1.6

D ~33

Thermal encapsulating.
Room temperature curing

easy-flowing and self-levelling
Low CTE*


*Coefficient of thermal expansion

 

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