ELANTAS

Chemistry

Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.

Do you need further information about our casting resins and potting resins? Please get in touch with us. We are looking forward to your email to castingpotting.elantas.europe@remove-this.altana.remove-this-also.com.

 Request Technical Product Datasheet

ProductTemp. RangeDielectric strength
at 20°C
Shore Hardness
at 23°C
ShoreGlass Transition
Temp.
Description
Bectron® MR 3402

-40°C to +125°C

>30 kV/mm15 ± 5Shore A-25°CMelting resin, one-component hot melt resin, thick film coating based on polyolefin
Bectron® MR 3404-40°C to +105°C>30 kV/mm20 ± 5Shore A-25°CMelting resin, one-component hot melt resin, thick film coating based on polyolefin
Bectron® MR 3405-40°C to +150°C>30 kV/mm30 ± 5Shore A-25°CMelting resin, one-component hot melt resin, thick film coating based on polyolefin
Bectron® MR 3406-40°C to +125°C>30 kV/mm14 ± 5Shore A-25°CMelting resin, one-component hot melt resin, thick film coating based on polyolefin

Bectron® MR 3406 FR

-40°C to +125°C9 kV/mm22Shore A-25°CMelting resin, one-component hot melt resin, thick film coating based on polyolefin
Product Temp. Range Dielectric strength
at 20°C
Shore Hardness
at 23°C
ShoreGlass Transition
Temp.
Description
Bectron® PB 3200

-55°C to +120°C

30 ± 10Shore A-50 °CPolybutadiene potting/encapsulation resin, two-component system, very flexible casting, good flexibility at very low temperature
Bectron® PB 3201 -60°C to +150°C>30 kV/mm70 ± 10Shore A-63°CPolybutadiene potting/encapsulation resin, two-component system, suitable for potting and casting
Bectron® PB 3251 -60°C to +150°C80 ± 10Shore A-63°CPolybutadiene potting/encapsulation resin, two-component system, resilient compound, suitable for potting and casting
Bectron® PB 3252 -55°C to +120°C13 kV/mm65 ± 10Shore A-55°CPolybutadiene potting/encapsulation resin, two-component system, suitable for potting and casting, excellent adhesion
Product Temp. Range Dielectric strength
at 20°C
Shore Hardness
at 23°C
ShoreGlass Transition
Temp.
Description

Bectron® PK 4330

-60°C to +125°C

22 kV/mm35 ± 10

Shore A

-50 °CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4332 -60°C to +125°C22 kV/mm35 ±10Shore A-50°CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4340 60°C to +125°C22 kV/mm70 ± 10Shore A-50 °CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 434260°C to +125°C22 kV/mm70 ± 10Shore A-50°CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4344-60°C to +125°C22 kV/mm70 ± 10Shore A-50 °CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black

Bectron® PK 4353 Blue

-50°C to +125°C20 kV/mm30 ± 10

Shore D

-50°CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, blue
Bectron® PK 4364 Blue-50°C to 125°C22 kV/mm40 ± 10Shore D-50°CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, blue
Bectron® PK 5542-50°C to +140°C9 kV/mm70 ± 10 Shore A-50°CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 5553-50°C to +150°C9 kV/mm30 ± 10Shore D5°CThick Film Coating and potting material, thermal cure, polyurethane, one-component system, black

Bectron® PU 4501

-40°C to +125°C73 kV/mm35 ± 10Shore A-5°CPolyurethane potting/encapsulation resin, two-component system, very soft transparent elastic polyurethane, clear resin, based on polyetherpolyol, no fillers
Bectron® PU 4513-40°C to +125°C22 kV/mm79 ± 9Shore A-10°CPolyurethane potting/encapsulation resin, two-component system, soft elastic polyurethane
Bectron® PU 4515-60°C to +150°C33 kV/mm75 ± 5Shore A< -75°CPolyurethane potting/encapsulation resin, two-component polyurethane system modified with polybutadiene
Bectron® PU 4522-40°C to +125°C18 kV/mm85 ± 5Shore A-22°CPolyurethane potting/encapsulation resin, two-component system, tough elastic moulding compound, flame retardant according to UL 94 V0
Bectron® PU 4526-40°C to +130°C21.6 kV/mm40 ± 10Shore D7°CPolyurethane potting/encapsulation resin, two-component system, medium hard moulding compound, flame retardant according to UL 94 V0
Bectron® PU 4532-40°C to +125°C25 kV/mm50 ± 5Shore D3°CPolyurethane potting/encapsulation resin, two-component system, resilient and flexible transparent polyurethane
Bectron® PU 4533-40°C to +120°C26 kV/mm45 ± 5Shore A-63°CPolyurethane potting/encapsulation resin, two-component system, transparent, elastic polyurethane
Bectron® PU 4534-40°C to +130°C15 kV/mm56 ± 10Shore A-46°CPolyurethane potting/encapsulation resin, two-component system, soft moulding compound, flame retardant acc. to UL 94 V0
Bectron® PU 4535-40°C to +120°C27 kV/mm55 ± 10Shore A-27°CPolyurethane potting/encapsulation resin, two-component system, resilient and flexible transparent polyurethane
Bectron® PU 4537-40°C to +155°C30 kV/mm64 ± 5Shore D30°CPolyurethane potting/encapsulation resin, two-component system, tough-elastic, thermal class F (155 °C) recognised acc. to UL 94
Product Temp. Range Dielectric strength
at 20°C
Shore Hardness
at 23°C
Shore

Glass Transition Temp.

Description
Bectron® EP 5502-40°C to +150°C24 kV/mm88 ± 5Shore A 70°CEpoxy resin, two-component system, pale yellow
Bectron® EP 5503 -40°C to +150°C32 kV/mm85 ± 5Shore D122°CEpoxy resin, two-component system, thixotropic, blue
Bectron® EP 5504 -40°C to +155°C20 kV/mm82 ± 5Shore D97°CEpoxy resin, two-component system, beige, self-extinguishing acc. to UL 94 V0, thermal class F (155°C), thermal conductivity of 1 W/(m*K)
Product Temp. Range Dielectric strength
at 20°C
Shore Hardness
at 23°C
Shore

Glass Transition Temp.

Description

Bectron® SG 75L2-30

-50°C to +180°C30 kV/mmn.a.< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone gel, meets UL 94 V0 flame retardant standard

Bectron® SG 75V1-15

-50°C to +200°C>15 kV/mmn.a.< -40°CSilicone potting/encapsulation resin, two-component system, forms a silicone gel compound by addition polymerisation, clear/transparent
Bectron® SG 75V1-60 -40°C to +200°C>10 kV/mmn.a.< -40°CSilicone gel, soft elastic, two-component system, suitable as a potting compound with high thermal resistance
Bectron® SG 75V1-75 -40°C to +180°C>15 kV/mmn.a.< -40°CSilicone gel, soft elastic, two-component system, suitable as a potting compound with high thermal resistance
Bectron® SK 75V1-35 -40°C to +180°C30 kV/mm35 ± 10Shore A< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone potting compound, UL 94 V1 listed
Bectron® SK 75V2-45 -55°C to +200°C8 kV/mm45 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone potting compound, flame retardant according to UL 94 V0
Bectron® SK 75V2-65 -40°C to +200°C11 kV/mm65 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system
Bectron® SK 76V2-50 -40°C to +180°C24 kV/mm50 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, elastic moulding compound
Bectron® SK 76V2-75 -40°C to +180°C>30 kV/mm75 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, silicone rubber, meets UL 94 V1 flame retardant standard