Potting materials for electronic applications

Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.

Do you need further information about our potting materials? Please get in touch with us. We are looking forward to your email to bectron.elantas.europe@remove-this.altana.remove-this-also.com.

Bectron® MR Range

ProductCuringShore Hardness at 23°CShoreDescription
Bectron® MR 340223°C15 ± 5Shore AMelting resin, one-component hot melt resin, thick film coating based on polyolefin
Bectron® MR 340523°C30 ± 5Shore AMelting resin, one-component hot melt resin, thick film coating based on polyolefin
Bectron® MR 340623°C14 ± 4Shore AMelting resin, one-component hot melt resin, thick film coating based on polyolefin

Bectron® MR 3406 FR

23°C22 ± 4Shore AMelting resin, one-component hot melt resin, thick film coating based on polyolefin, flame retardant

 

Bectron® PUR Range

ProductTemp. RangeDielectric strength
at 20°C
Shore Hardness
at 23°C
Shore

Glass Transition Temp.

Description

Bectron® PB 3200

-55°C to +120°C 30 ± 10

Shore A

-50°CPolybutadiene potting/encapsulation resin, two-component system, very flexible casting, good flexibility at very low temperature
Bectron® PB 3201-60°C to +150°C>30 kV/mm70 ± 10Shore D-63°CPolybutadiene potting/encapsulation resin, two-component system, suitable for potting and casting
Bectron® PB 3251-60°C to +150°C 80 ± 10Shore A-63°CPolybutadiene potting/encapsulation resin, two-component system, resilient compound, suitable for potting and casting
Bectron® PB 3252-55°C to +120°C13 kV/mm65 ± 10Shore A-55°CPolybutadiene potting/encapsulation resin, two-component system, suitable for potting and casting, excellent adhesion
Bectron® PK 4330-60°C to +125°C22 kV/mm35 ± 10Shore A-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4332-60°C to +125°C22 kV/mm35 ± 10Shore A-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4340-60°C to +125°C22 kV/mm70 ± 10Shore A-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4342-60°C to +125°C22 kV/mm70 ± 10Shore A-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 4344-60°C to +125°C22 kV/mm70 ± 10Shore A-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black

Bectron® PK 4353 Blue

-50°C to +125°C20 kV/mm30 ± 10

Shore D

-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, blue
Bectron® PK 4364 Blue-50°C to +125°C22 kV/mm40 ± 10Shore D-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, blue
Bectron® PK 5542-50°C to +140°C9 kV/mm70 ± 10Shore A-50°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black
Bectron® PK 5553-50°C to +150°C9 kV/mm30 ± 10Shore D5°CThick film coating and potting material, thermal cure, polyurethane, one-component system, black

Bectron® PU 4501

-40°C to +125°C73 kV/mm35 ± 10Shore A-40°CPolyurethane potting/encapsulation resin, two-component system, soft transparent elastic polyurethane plastic, clear resin based on polyetherpolyol, no fillers
Bectron® PU 4512-40°C to +125°C20 kV/mm70 ± 10Shore A-5°CPolyurethane potting/encapsulation resin, two-component system, soft elastic polyurethane
Bectron® PU 4513-40°C to +125°C22 kV/mm79 ± 9Shore A-10°CPolyurethane potting/encapsulation resin, two-component system, soft elastic polyurethane
Bectron® PU 4515-60°C to +150°C33 kV/mm75 ± 5Shore A< -75°CPolyurethane potting/encapsulation resin, two-component polyurethane system modified with polybutadiene
Bectron® PU 4516-40°C to +130°C23 ± 2 kV/mm70 ± 10Shore D30°CPolyurethane potting/encapsulation resin, two-component system
Bectron® PU 4519-40°C to +125°C22 kV/mm75 ± 10Shore A-10°CPolyurethane potting/encapsulation resin, two-component system, soft elastic polyurethane
Bectron® PU 4520-40°C to +125°C23 kV/mm75 ± 10Shore A-10°CPolyurethane potting/encapsulation resin, two-component system, soft elastic polyurethane
Bectron® PU 4522

-40°C to 
+125°C

18 kV/mm85 ± 5Shore A-22°CPolyurethane potting/encapsulation resin, two-component system, tough elastic moulding compound, flame retardant  according to UL 94 V0
Bectron® PU 4526-40°C to +130°C21.6 kV/mm40 ± 10Shore D+7°CPolyurethane potting/encapsulation resin, two-component system, medium hard moulding compound, flame retardant according to UL 94 V0

Bectron® PU 4526 K5

-40°C to +130°C21.6 kV/mm40 ± 10Shore D+7°CPolyurethane potting/encapsulation resin, two-component system, medium hard moulding compound, flame retardant according to UL 94 V0, accelerated gel time compared to  standard Bectron® PU 4526
Bectron® PU 4527-40°C to +125°C21.6 kV/mm60 ± 5Shore D12°CPolyurethane potting/encapsulation resin, two-component system
Bectron® PU 4532-40°C to +125°C23.5 kV/mm50 ± 5Shore D+3°CPolyurethane potting/encapsulation resin, two-component system, resilient and flexible transparent polyurethane
Bectron® PU 4533

-40°C to
+120°C

23.5 kV/mm30 ± 8Shore A-63°CPolyurethane potting/encapsulation resin, two-component system, transparent, elastic polyurethane
Bectron® PU 4534-40°C to +130°C15 kV/mm56 ± 10Shore A-46°CPolyurethane potting/encapsulation resin, two-component system, soft moulding compound, flame retardant according to UL 94 V0
Bectron® PU 4535-40°C to +130°C16 kV/mm55 ± 10Shore A-27°CPolyurethane potting/encapsulation resin, two-component system, resilient and flexible transparent polyurethane
Bectron® PU 4536-40°C to +130°C19 kV/mm75 ± 10Shore D48°CPolyurethane potting/encapsulation resin, two-component system, hard transparent polyurethane
Bectron® PU 4537-40°C to +155°C30 kV/mm64 ± 10Shore D30°CPolyurethane potting/encapsulation resin, two-component system, tough-elastic, thermal class F (155 °C) recognised acc. to UL 94

 

Bectron® SK and SG Range 

1- & 2-component silicone resins, addition or condensation cure

Product

Temp. Range

Dielectric strength
at 20°C

Shore Hardness
at 23°C
ShoreDescription

Bectron® SG 75L2-30

-50°C to +180°C11 kV/mmn.a. Silicone potting/encapsulation resin, two-component system, soft silicone gel, meets UL 94 V0 flame retardant standard

Bectron® SG 75V1-15

-50°C to +200°C>15 kV/mmn.a. Silicone potting/encapsulation resin, two-component system, forms a silicone gel compound by addition polymerisation, clear/transparent
Bectron® SK 75V1-35-40°C to +180°C30 kV/mm35 ± 10Shore ASilicone potting/encapsulation resin, two-component system, soft silicone potting compound, UL 94 V1 listed
Bectron® SK 76V2-50-40°C to +180°C24 kV/mm50 ± 5Shore ASilicone potting/encapsulation resin, two-component system, elastic moulding compound
Bectron® SK 76V2-75-40°C to +180°C>30 kV/mm75 ± 5Shore ASilicone potting/encapsulation resin, two-component system, silicone rubber, meets UL 94 V1 flame retardant standard
ProductTemp. RangeCuringDielectric strength
at 20°C
Shore Hardness
at 23°C
Shore

Glass Transition Temp. 

DescriptionChemistry

Bectron® EP 5502

-40°C to +150°C23°C24 kV/mm 87.5 ± 2.5

Shore A

70°CEpoxy resin, two-component system, pale yellow 
Bectron® EP 5503-40°C to +150°C23°C32 kV/mm85 ± 5

Shore D

122°CEpoxy resin, two-component system, thixotropic, blue 
Bectron® EP 5504-40°C to +155°C23°C20 kV/mm82 ± 5Shore D97°CEpoxy resin, two-component system, self-extinguishing acc. to UL 94 V0, thermal class F (155°C), thermal conductivity of 1 W/(m*K) Epoxy

Bectron® MR 3405

-50°C to +150°C23°C30 kV/mm30 ± 5Shore A-25°CMelting resin, one-component hot melt resin thick film coating, based on polyolefinPolyolefin
Bectron® PB 3251-60°C to +150°C23°C 80 ± 10Shore A-63°CPolybutadiene potting/encapsulation resin, two-component system, resilient compound, suitable for potting and castingPolybutadiene
Bectron® PU 4515-60°C to +150°C23°C33 kV/mm75 ± 5Shore A< -75°CPolyurethane potting/encapsulation resin, two-component polyurethane system modified with polybutadienePolyurethane
Bectron® PU 4537-40°C to +155°C23°C30 kV/mm64Shore D30°CPolyurethane potting/encapsulation resin, two-component system, tough-elastic, thermal class F (155 °C) recognised acc. to UL 94Polyurethane

Bectron® SG 75L2-30

-50°C to +180°C23°C11 kV/mmn.a. < -40°CSilicone potting/encapsulation resin, two-component system, soft silicone gel, meets UL 94 V0 flame retardant standardSilicone

Bectron® SG 75V1-15

-50°C to +200°C23°C>15 kV/mmn.a. < -40°CSilicone potting/encapsulation resin, two-component system, forms a silicone gel compound by addition polymerisation, clear/transparentSilicone
Bectron® SG 75V1-75-40°C to +180°C23°C>10 kV/mmn.a. < -40°CSilicone gel, soft elastic, two-component system, suitable as a potting compound with high thermal resistanceSilicone
Bectron® SK 75V1-35-40°C to +180°C90°C30 kV/mm35 ± 10Shore A< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone potting compound, UL 94 V1 listedSilicone
Bectron® SK 75V2-45-55°C to +200°C23°C8 kV/mm45 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone potting compound, flame retardant according to UL 94 V0Silicone
Bectron® SK 75V2-65-40°C to +200°C23°C11 kV/mm65 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component systemSilicone
Bectron® SK 76V2-50-40°C to +180°C23°C24 kV/mm50 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, elastic moulding compoundSilicone
Bectron® SK 76V2-75-40°C to +180°C23°C>30 kV/mm75 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, silicone rubber, meets UL 94 V1 flame retardant standardSilicone

1- & 2-component resins with very good elasticity and flexibility at temperatures of -40°C or below

 

ProductTemp. RangeCuringDielectric strength
at 20°C
Shore Hardness
at 23°C
Shore

Glass Transition Temp. 

DescriptionChemistry

Bectron® EP 5502

-40°C to +150°C23°C24 kV/mm 87.5 ± 2.5

Shore A

70°CEpoxy resin, two-component system, pale yellow 
Bectron® EP 5503-40°C to +150°C23°C32 kV/mm85 ± 5

Shore D

122°CEpoxy resin, two-component system, thixotropic, blue 
Bectron® EP 5504-40°C to +155°C23°C20 kV/mm82 ± 5Shore D97°CEpoxy resin, two-component system, self-extinguishing acc. to UL 94 V0, thermal class F (155°C), thermal conductivity of 1 W/(m*K) Epoxy

Bectron® MR 3405

-50°C to +150°C23°C30 kV/mm30 ± 5Shore A-25°CMelting resin, one-component hot melt resin thick film coating, based on polyolefinPolyolefin
Bectron® PB 3251-60°C to +150°C23°C 80 ± 10Shore A-63°CPolybutadiene potting/encapsulation resin, two-component system, resilient compound, suitable for potting and castingPolybutadiene
Bectron® PU 4515-60°C to +150°C23°C33 kV/mm75 ± 5Shore A< -75°CPolyurethane potting/encapsulation resin, two-component polyurethane system modified with polybutadienePolyurethane
Bectron® PU 4537-40°C to +155°C23°C30 kV/mm64Shore D30°CPolyurethane potting/encapsulation resin, two-component system, tough-elastic, thermal class F (155 °C) recognised acc. to UL 94Polyurethane

Bectron® SG 75L2-30

-50°C to +180°C23°C11 kV/mmn.a. < -40°CSilicone potting/encapsulation resin, two-component system, soft silicone gel, meets UL 94 V0 flame retardant standardSilicone

Bectron® SG 75V1-15

-50°C to +200°C23°C>15 kV/mmn.a. < -40°CSilicone potting/encapsulation resin, two-component system, forms a silicone gel compound by addition polymerisation, clear/transparentSilicone
Bectron® SG 75V1-75-40°C to +180°C23°C>10 kV/mmn.a. < -40°CSilicone gel, soft elastic, two-component system, suitable as a potting compound with high thermal resistanceSilicone
Bectron® SK 75V1-35-40°C to +180°C90°C30 kV/mm35 ± 10Shore A< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone potting compound, UL 94 V1 listedSilicone
Bectron® SK 75V2-45-55°C to +200°C23°C8 kV/mm45 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, soft silicone potting compound, flame retardant according to UL 94 V0Silicone
Bectron® SK 75V2-65-40°C to +200°C23°C11 kV/mm65 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component systemSilicone
Bectron® SK 76V2-50-40°C to +180°C23°C24 kV/mm50 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, elastic moulding compoundSilicone
Bectron® SK 76V2-75-40°C to +180°C23°C>30 kV/mm75 ± 5Shore A< -40°CSilicone potting/encapsulation resin, two-component system, silicone rubber, meets UL 94 V1 flame retardant standardSilicone

Resins with very good light transmission

Product

Mixing Ratio

Temp. RangeCuring

Dielectric strength 
at 20°C

Shore Hardness
at 23°C
ShoreDescriptionChemistry

Bectron® PU 4501

100 : 50

-40°C to +125°C

23°C73 kV/mm35 ± 10Shore APolyurethane potting/encapsulation resin, two-component system, very soft transparent elastic polyurethane,clear resinPolyurethane
Bectron® PU 4532100 : 125-40°C to +125°C23°C25 kV/mm50 ± 5Shore DPolyurethane potting/encapsulation resin, two-compoent system, resilient and flexible transparent polyurethanePolyurethane
Bectron® PU 4533100 : 11-40°C to +120°C23°C26 kV/mm30 ± 8

Shore A

Polyurethane potting/encapsulation resin, two-component system, transparent, elastic polyurethanePolyurethane
Bectron® PU 4535100 : 60-40°C to +120°C23°C27 kV/mm55 ± 10Shore APolyurethane potting/encapsulation resin, two-component system, resilient and flexible transparent polyurethanePolyurethane

Bectron® SG 75V1-15

1 : 1-50°C to +200°C23°C>15 kV/mmn.a. Silicone potting/encapsulation resin, forms a silicone gel compound by addition polymerisation, clear, transparent, meets UL 94 V0 flame retardant standardSilicone
Bectron® SG 75V1-601 : 1-40°C to +200°C23°C>10 kV/mmn.a. Silicone gel, soft elastic, suitable as a potting compound with high thermal resistance 
Bectron® SG 75V1-751 : 1-40°C to +180°C23°C>15 kV/mmn.a. Silicone gel, soft elastic, suitable as a potting compound with high thermal resistanceSilicone

high temperature resistance

ProductTemp. RangeDielectric strength
at 20°C
Shore Hardness
at 23°C
ShoreDescriptionChemistry

Bectron® SG 75L2-30

-50°C to +180°C

30 kV/mmn.a. Silicone potting/encapsulation resin, two-component system, soft silicone gel, meets UL 94 V0 flame retardant standardSilicone

Bectron® SG 75V1-15

-50°C to +200°C>15 kV/mmn.a. Silicone potting/encapsulation resin, two-component system, forms a silicone gel compound by addition polymerisation, clear/transparentSilicone

Bectron® SG 75V1-60

-40°C to +200°C>10 kV/mmn.a. Silicone gel, soft elastic, two-component system, suitable as a potting compound with high thermal resistanceSilicone

Bectron® SG 75V1-75

-40°C to +180°C>15 kV/mmn.a. Silicone gel, soft elastic, two-component system, suitable as a potting compound with high thermal resistanceSilicone
Bectron® SK 75V1-35-40°C to +180°C30 kV/mm35 ± 10Shore ASilicone potting/encapsulation resin, two-component system, soft silicone potting compound, UL 94 V1 listedSilicone
Bectron® SK 75V2-45-55°C to +200°C8 kV/mm45 ± 5Shore ASilicone potting/encapsulation resin, two-component system, soft silicone potting compound, flame retardant according to UL 94 V0 
Bectron® SK 75V2-65-40°C to +200°C11 kV/mm65 ± 5Shore ASilicone potting/encapsulation resin, two-component system 
Bectron® SK 76V2-50-40°C to +180°C24 kV/mm50 ± 5Shore ASilicone potting/encapsulation resin, two-component system, elastic moulding compound 
Bectron® SK 76V2-75-40°C to +180°C>30 kV/mm75 ± 5Shore ASilicone potting/encapsulation resin, two-component system, silicone rubber, meets UL 94 V1 flame retardant standard