Printed Electronics Days


Join us at our 5th Printed Electronics Days Conference where industry experts will share their knowledge on cutting-edge and specialized topics from various angles and first-hand. With a lineup of 18 engaging lectures, you'll explore the entire process chain, from functional inks and printing techniques to market insights and best practice applications. A special focus will be on innovation and trends.

Registration fee € 320,00 excl. VAT per person

Venue: Hotel Hafen Hamburg, Seewartenstr. 9, 20459 Hamburg, Germany


Monday, September 9th 2024

12:30 p.m. - 06:30 p.m.

Nils Arendt
Head of Marketing, Sales & Technology


Nicola Cuminetti
Head of R&D Europe


Thin, light, flexible and robust are the key characteristics of printed electronics, which can be seamlessly integrated into a wide range of products. This enables new applications in a variety of industries, including automotive, consumer electronics, healthcare, printing/packaging and smart buildings, as well as its growing presence in the Internet of Things (IoT) - in short, "electronics everywhere". At the same time, there is a growing need for sustainable and circular electronics due to its quantities but also specifics of conventional electronics. Flexible and printed electronics enable more sustainable electronics by using new materials and processes, as well as through their lightweight nature.

Dr. Klaus Hecker
Managing Director
OE-A (Organic and Printed Electronics Association)
A working group within VDMA

Session "Stretch - Wearables/Sensors"

Christine Kallmayer
Group Manager
Fraunhofer IZM Berlin

Dr. Klas-Moritz Kossel
Project Lead R&D Specialty Films

Two main advantages of Printed Electronics are flexibility and transparency.  Both features complement traditional electronic systems. At Kundisch we devote our production and development efforts to these advantages. In this presentation we will show the latest advances in transparent antennas and their production with high yields. The challenge of high conductivity, freedom of design and high transparency is mastered in these products. 

Additionally we show how to integrate ICs in stretchable products converting analog signals to digital as near to the signal source as possible. A possible game changer wearable electronics where contacting has been a real troublemaker in the past.

Sebastian Gepp
Head of Developement Printed Electronics
Kundisch GmbH & Co. KG

SESSION „ Application Scenarios I “

Dr. Florian Ullrich
Head of Business Development

Dr. Martin Kirchner
Technical Sales Manager Electronics

Dr. Philip Renners
Vice President of Research & Development
Witte Technology GmbH

SESSION „ Innovation“

The demand for printed electronics, especially sensors, is constantly growing over the last few years. Standard printing techniques like screen or inkjet printing are widely used with great success. Most of the substrates are two dimensional like foils printed in a either roll to roll or sheet to sheet process.

Often these substrates have to be connected with the actual surface where the function is needed
for instance via an extra gluing or laminating process. In contrast, the binder innovation and technology center is using an alternative approach. For three dimensional or structured substrates, pad printing is used. The function is directly printed on the substrate without any additional process. During the printing process, the paste is transferred from a printing form (cliché) via a silicon pad directly on the substrate. This process is well established for high volume production in marketing or graphic printing.

In order to achieve a reproducible and stable functional layer special needs of the printing pastes in terms of viscosity and homogenous preparation are required. Typical line widths are 80 - 100 µm and a layer thickness of 8-15 µm. Applications range from force and touch sensors as well as heating devices or bioelectrodes.

Although not intended for this printing technique binder uses different ELANTAS printing pastes for this purpose with great success since many years.

Dr. Stefan Ernst
Project Manager
Franz Binder GmbH & Co. Elektrische Bauelemente KG

Berit Schuster
Head of R&D Printed Electronics


to be confirmed

Dr. Alexander Beer
Head of Business Line Electronic

Tuesday, September 10th 2024

09:00 a.m. - 02:30 p.m.

Dr. Alexander Beer
Head of Business Line Electronic


Michael Olk
Business Development Manager Printed Electronics, Battery Management Systems


Armin Senne
Head of Printed Electronics 
Continental Surface Solutions

SESSION „ Application Scenarios II “

Silver based conductive ink is the backbone of the Printed Electronics. Unfortunately, silver metal price is almost doubled in the last five years. Therefore, there is an urgent need to find a low-cost alternative. Saralon offers a low-cost copper-based conductive ink with comparable conductivity. Different applications based on Saralon’s copper ink will be explained during the presentation.

Dr. Moazzam Ali
Saralon GmbH

Ben Robesin
Application Specialist 
SPGPrints B.V.

Screen-printing is an additive dry printing process where inks, or print pastes are used to create patterns on substrates through a fine mesh of threads. Nowadays, with the latest further developed conductive inks, screen printing enables to print RFID antenna structures on more economic and flexible substrates, such as cellulose-based and synthetic paper. In this presentation, we will explore upon the practical functionality of producing single layer ultra-high frequency (UHF) and multi-layer near-field communication (NFC) radio frequency identification (RFID) transponders that are screen printed on various flexible substrates. In focus will be the prerequisites and process principles, types of inks and substrates, key requirements, challenges and limitations. Additionally, we will discuss tag performance and quality assurance topics for some critical parameters, such as antenna resistance and chip assembly requirements, to illustrate the key requirements upon printing RFID antennas. The technology and processing lays a groundwork for an innovative, sustainable, scalable and economically competitive production of RF antennas for RFID and NFC applications and smart labels, Internet-of-Things (IoT) applications, on-body-sensor monitoring for bio medical and sports solutions.

Luis Da Cunha                          Syaiful Mohd
Printed Electronics Supervisor   RFID Field Engineer
Victor Buck Services                 Victor Buck Services

SESSION „HMI & Lightning“

Maja Besednjak
R&D Engineer
CCL Design Stuttgart GmbH 

Automated integration of (functional) foils to a particular device is often a very challenging task in the production process, especially when 3D geometries are involved. For this purpose the KURZ Group developed the patent-pending Functional Foil Bonding (FFB) process that is suitable for a high degree of automation. Especially, this post mold process is capable of bonding foils to surfaces that exhibit 3D geometries. In this presentation the basic principles of the FFB process are introduced. Advantages, possibilities, and limits of this approach, which allows integration of foils providing function and/or light to the device, are further discussed at the example of different current series projects.

Dr. Tobias Hümpfner
Development Engineer
PolyIC GmbH & Co. KG

Dr. Hans-Peter Erfurt
Head of IMD/FIM-Technology
Pröll GmbH 


Dr. Alexander Beer
Head of Business Line Electronic